Physix FrontierPhysix Frontier · News Briefing Card (IT Home · Nov 9, 2026)
Musk's Terafab chip fab plan: 1M wafers/month by 2032
KEY FACTS
- Musk's Terafab has submitted an order plan to Japanese equipment suppliers and is pressing them to get the fab operational.
- Terafab is a joint venture between SpaceX and Tesla and plans to begin volume production in Q3 2028.
- The fab targets monthly output of 1 million wafers by 2032, split into 700,000 memory chips and 300,000 logic chips.
- Samsung's current DRAM monthly capacity is about 650,000 to 700,000 wafers, on par with Terafab's memory target.
- Terafab plans to produce its first SRAM test chip at its Austin R&D base in May-June next year.
KEY DATA
Q3 2028Volume production date
1 million wafers2032 monthly capacity target
700,000 wafersOf which memory chip monthly capacity
About 650,000 to 700,000 wafersSamsung DRAM monthly capacity
PHYSIX OBSERVATION
A new player is claiming it can match Samsung's memory capacity in six years, an ambition far beyond the pace of a typical startup. But equipment orders have only just begun and the first test chip has yet to roll off the line, making the capacity pledge extremely hard to deliver. For the industry, this looks more like a long-term pressure signal; for users, a near-term shift in the chip supply landscape is unlikely.
Source: IT Home report