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Physix Frontier · News Briefing Card (IT Home · Oct 29, 2026)

Xinxin Hangtu unveils X9 large-model chip with 3000 TOPS, due 2027

KEY FACTS

  • Xinxin Hangtu unveiled its next-generation large-model chip, the X9, at the end of its October 29 launch event.
  • The X9 is planned for launch in 2027, with a target compute of 3000 TOPS.
  • The X9's single-chip memory bandwidth target is 700GB/s.
  • The X9 continues the large-model-defined chip approach, with software-hardware co-design built around next-generation world models.
  • CEO Li Zonglin said the company maintains a research cadence of mass-producing one generation, developing one generation, and pre-researching one generation.

KEY DATA

3000 TOPSX9 compute
700GB/sX9 memory bandwidth
2027X9 planned launch
under 24 hoursTime to bring up first X7 chip

PHYSIX OBSERVATION

The 3000 TOPS plus 700GB/s combination shows that the automotive chip race has shifted from piling on compute to weighting compute and bandwidth equally, otherwise large models simply cannot run. With landing not until 2027, the window is not short; the key question is whether the real-world performance of the X7 once it reaches mass production and ships in vehicles can sustain this iteration curve.

Source: IT Home report