Siliconware Kicks Off Douliu Plant, Plans CoWoS Packaging

Siliconware's hefty bet on CoWoS signals that the packaging and testing giant is deepening its shift from traditional contract work into the core of AI compute. The 2028 production timeline looks somewhat late, but it reflects the stringent yield and ecosystem demands of advanced heterogeneous integration. The move not only intensifies the advanced-packaging arms race on the island but also hints that the global AI chip supply chain is turning to vertical integration to tackle capacity bottlenecks; users should watch how the subsequent release of capacity reshapes the market landscape.