Biwin to invest 4.5B yuan in Dongguan packaging Phase III: what are the key facts?

Biwin Storage will invest 4.5 billion yuan in the third phase of its Dongguan advanced packaging and testing project.

Biwin to invest 4.5B yuan in Dongguan packaging Phase III: what are the key facts?

The Phase III investment exceeds the 3.09 billion yuan combined total of the first two phases.

Biwin to invest 4.5B yuan in Dongguan packaging Phase III: what are the key facts?

The first two phases have yet to generate mass-production revenue and remain in customer sampling and process validation.

Biwin to invest 4.5B yuan in Dongguan packaging Phase III: what are the key facts?

The company expects monthly capacity to reach 10,000 wafers by the end of 2027, more than triple the current level.

Biwin to invest 4.5B yuan in Dongguan packaging Phase III: what are the key facts?

Biwin already operates a conventional storage and SiP packaging base in Huizhou, with chips sourced from external suppliers.

Physix Frontier · News Briefing Card (enbrief · Sep 24, 2026)

Biwin to invest 4.5B yuan in Dongguan packaging Phase III

KEY FACTS

Biwin Storage will invest 4.5 billion yuan in the third phase of its Dongguan advanced packaging and testing project.
The Phase III investment exceeds the 3.09 billion yuan combined total of the first two phases.
The first two phases have yet to generate mass-production revenue and remain in customer sampling and process validation.
The company expects monthly capacity to reach 10,000 wafers by the end of 2027, more than triple the current level.
Biwin already operates a conventional storage and SiP packaging base in Huizhou, with chips sourced from external suppliers.

KEY DATA

4.5 billion yuan (about $672 million)Phase III investment

3.09 billion yuanCombined investment of first two phases

10,000 wafersEnd-2027 monthly capacity target

PHYSIX OBSERVATION

Chinese memory makers are climbing from module packaging to wafer-level advanced packaging, a critical step toward higher value-added output. But with the first two phases yet to reach mass production and Phase III now absorbing heavy capital, the risks in capacity ramp-up and customer validation are considerable. The signal: competition in memory is shifting from price to packaging technology, and whoever gets wafer-level processes working first has a chance to escape the low-margin contract-manufacturing role.

Source: enbrief original report ↗