Xingfan Intelligence

Apps & Agents

New roundUSD 44M2026-07

Xingfan Intelligent closed a new round of over RMB 300M on July 6, 2026, led by Dingxu Investment, followed by Kaipuyun, Gaojie Capital, Anshu Capital, et al.; funds used for next-generation embodied intelligence brain chip R&D for physical AI and data flywheel construction.

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Total funding: RMB 44M
Data cutoff: 2026-08-16

Company Profile

Xingfan Intelligence (XFEON), based in Chengdu since 2021, builds infrastructure for physical AI using agent chips and data flywheels. Transitioning from compute services to chip design, the company delivered thousands of units and secured over 300 million RMB in new funding during 2026.

Founded: 2021
Headquarters: China