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Apps & Agents
Series B RoundUSD 50M2026-08

closed a Series B round of hundreds of millions RMB to advance R&D and industrialization of 400G/800G Scale-out smart NIC chips, while simultaneously laying out GPU Scale-up high-speed interconnect chips. Existing shareholders such as Tsinghua Ginkgo and Yuanhe Capital continued to increase their stakes.

View funding history →
Total funding
RMB 50M
Data cutoff
2026-09-01

Company Profile

Reconfigurable architecture chip designer producing RDMA network cards and quantum cryptography solutions. Reduces reliance on advanced nodes via time-space parallelism, delivering sub-3μs latency. Offers N30 series 400G smart NICs and develops GPU interconnect chips comparable to NVLink.

Founded
2018
Headquarters
China