G

Guangyu Xincheng

Apps & Agents
Series A Round—2026-09

Announced completion of Round A closing on Sep 10, cumulative financing nearly RMB 2B within half a year; Round A single-round amount not separately disclosed

View funding history →
Total funding
USD 290M
Data cutoff
2026-09-14

Company Profile

Established in July 2024 by Enflame and GigaDevice, Guangyu Xincheng develops edge-side large model inference chips using 3D stacked near-memory computing. Its TC1000 series supports 3B parameter models on single chips. The startup raised nearly 2 billion yuan within six months to accelerate mass production and cloud inference development.

Founded
2024
Headquarters
Shanghai, China