Eswin Computing
Main Board IPO on HKEX at HKD 1.55 per share, issuing approximately 162 million H shares, raising over HKD 2.5 billion in gross proceeds (net proceeds of approximately HKD 2.386 billion), with cornerstone investment of approximately HKD 1.16 billion. This is the company's first recorded round; pre-IPO primary market rounds are pending entry.
View funding history →- Data cutoff
- 2026-10-10
Company Profile
Eswin Computing, founded in September 2019 and headquartered in Beijing, is a fabless chip provider built on the RISC-V architecture, founded by Wang Dongsheng, the founder of BOE. It designs human-machine interaction and multimedia processing chips, interconnect and computing chips, plus chipsets, boards and software, and was China's largest domestic supplier of human-machine interaction chips for smart terminals by 2025 revenue. Eswin Computing listed on the Hong Kong Stock Exchange (01256.HK) on October 9, 2026 as the market's first RISC-V chip stock, raising over HKD 2.5 billion in its IPO.
- Founded
- 2019
- Headquarters
- Beijing, China
- Website
- www.eswincomputing.com
- Listing
- HKEX · 01256.HK
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