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Black Sesame Technologies

Apps & AgentsListed · HKEX 02533.HK
Post-IPO Strategic Placement—2026-03

Entered into a subscription agreement with Wuji Capital for the R&D of new-generation high-performance chips (high-compute chips for autonomous driving and robotics, edge-side AI chips) and the construction of overseas R&D centers. The placement agent withdrew midway, but the company stated that the financing process is proceeding normally.

View funding history →
Data cutoff
2026-10-03

Company Profile

Black Sesame Technologies develops automotive-grade autonomous driving chips listed on the HKEX. Its Huashan SoCs are deployed at scale, while the A2000 family targets high-compute physical AI needs. The firm offers full-stack capabilities including proprietary ISP, NPU, and toolchain software.

Founded
2016
Headquarters
Wuhan, China
Listing
HKEX · 02533.HK